EDC-700 Series Massflow Controller and Meters
- Full Scale Flow Range: 1slpm-200slpm
- Maximum Pressure Rating: 42Mpa
- Repeatability: ±0.2% F.S
- Control Range: 2%~100% F.S
- Response Time: <0.8s
- Operating Temperature:0~50℃
- Digital Communication:RS-485(Modbus RTU)
- Analog Communication:0~5 V / 4~20mA
Description of EDC-700 Massflow Controller and Metes
The EDC-700 series Mass Flow Controller (MFC) is specifically designed for the measurement and control of high-pressure gases. Utilizing an advanced capillary-based thermal differential temperature principle and incorporating an integrated pressure compensator alongside a comprehensive gas-property database, the series offers high pressure resistance, corrosion resistance, superior accuracy, and excellent repeatability. It is widely employed in applications requiring precise and stable gas flow measurement or control. The electrical interfaces have undergone rigorous Electromagnetic Compatibility (EMC) testing, ensuring robust performance even in complex industrial environments prone to static electricity, surges, and electrical fast transients (EFT). The EDC series is CE and RoHS certified; with customizable flow ranges and operating pressures, it serves as an ideal solution for high-pressure applications.
The EDC-700 series supports inlet pressures of up to 42 MPa, with outlet conditions ranging from high pressure and atmospheric pressure to vacuum. The MFC’s operation remains unaffected by changes in outlet pressure (or differential pressure), with an allowable operating differential pressure range of 0.5 to 42 MPa. By utilizing this dynamic differential pressure MFC, users can adjust back-pressure on the process side (or at the MFC outlet) as needed—without the need for frequent readjustments of pressure-reducing valves—thereby significantly enhancing system usability and reliability. Furthermore, this dynamic differential pressure MFC is frequently used in applications involving the pressurization of sealed vessels via gas injection.
Biosflows EDC-700 Massflow Controller and Metes Technical Parameters
| Performance | |
|---|---|
| Flow Accuracy | ±1%F.S |
| Repeatability | ±0.2%F.S |
| Control Range | 2%~100%F.S |
| Response Time | <0.8s |
| Temperature Coefficient | Zero:<0.05%of F.S./℃.Span:<0.1%of S.P./℃ |
| Pressure Coefficient | 0.2%of S.P./Bar |
| Operating Coefficient | 0~50℃ |
| Leakage rate | 1x10-9 atm.cc/sec He |
| Warm-up time | 5min accuracy:±5%F.S(30 min to achieve the best accuracy) |
| Electrical Parameters | |
| Power Supply | +15～24 Vdc |
| Max.Power Consumption | 10W(MFC);3W(MFM) |
| Analog Communication | 0～5V/4～20mA |
| Digital Communication | RS-485( Modbus RTU Protocol) |
| Electrical Interface | 9-pin D-connector (male) |
| Mechanical Parameters | |
| Valve Type | Normally Closed(MFM is irrelevant) |
| Base Material | 316LStainless Steel |
| Seal Material | FKM,EPDM,NBR |
| Gas Port Connection | American/National Standard Ferrule or VCR Fitting |
EDC-700 Selection Guide
| Model | Max Full-sacle | Min Full-sacle | Withstand Pressure | Max Operating Pressure | Max Operating △P |
|---|---|---|---|---|---|
| EDC-720 | 30 SLM | 1 SLM | 6500 Psi/420 Bar | 6500 Psi/420 Bar | 6500 Psi/420 Bar |
| EDC-730 | 100 SLM | 30 SLM | 6500 Psi/420 Bar | 6500 Psi/420 Bar | 6500 Psi/420 Bar |
| EDC-740 | 200 SLM | 100 SLM | 6500 Psi/420 Bar | 6500 Psi/420 Bar | 6500 Psi/420 Bar |
EDC-700 Massflow Controller and Metes Size and Weight
| Model | A | B | C | D | H | E | F | G | M | Weight |
|---|---|---|---|---|---|---|---|---|---|---|
| EDC-720 | 113 | 164 | 26 | 60 | 153 | 84 | 24 | 14 | M5 | 3.3 |
| EDC-730 | 113 | 164 | 26 | 60 | 153 | 84 | 24 | 14 | M5 | 3.3 |
| EDC-740 | 113 | 164 | 26 | 60 | 153 | 84 | 24 | 14 | M5 | 3.3 |
Features of EDC-700 Massflow Controller and Metes
42 MPa dynamic pressure differential
Supports a dynamic pressure differential of up to 42 MPa, ensuring more stable high-pressure control with adaptive response to pressure differential fluctuations. The sensor and valve body are made of 316L stainless steel, making them suitable for use with toxic and corrosive gases.
High Reliability and Performance
High-performance components are tested seven times consecutively in accordance with semiconductor industry standards to ensure their reliability, which is superior to semiconductor industry standard levels in reliability, ensuring reproducible measurement results and highly stable performance over a long period of use.
New Generation Sensor Design
Innovative sensor design, small influence of temperature and pressure changes, accurate temperature and pressure correction, high linearity can provide excellent signal-to-noise ratio performance to improve measurement and control accuracy under low set-point conditions Long-term zero point stability.
Multi-gas and span adjustment functions
Choose one device platform to meet the needs of different gases and flow ranges, store and pre-set multiple gas calibration information, users only need one device to easily switch between different gases and ranges and reduce inventory, through software or PLC can be implemented without disconnecting the instrumentation from the system.
Aplication of EDC-700 Massflow Controller and Metes
Epitaxial Process System
The epitaxial process refers to the process of growing a fully aligned single crystal layer on a substrate. In the manufacture of integrated circuits, the commonly used epitaxy method is vapor phase epitaxy. During the epitaxy process, the gas flow into the reaction chamber needs to be precisely controlled. MFC can be equipped on the gas supply line. By adjusting the control parameters of MFC (such as current or pressure), precise control of gas flow can be achieved to ensure stable and accurate gas flow required in the epitaxy process.
Photovoltaic Industry
A certain amount of gas needs to be supplied during the preparation of solar cells, such as precursor gas and protective gas used to prepare thin films. MFC can be used to control the flow of these gases to ensure the stability and repeatability of the solar cell fabrication process. Flow devices are used in the application layer of crystalline silicon wafers for conventional silicon-based solar cells, as well as in the fabrication of thin layers on flexible substrates as second-generation amorphous silicon-based thin-film solar cell components.
Vapor Deposition System
Vapor deposition is a commonly used thin film preparation technology. The gas precursor is sent into the reaction chamber, and the gas precursor is deposited on the surface of the substrate to form a thin film through a chemical reaction or physical process. MFC can accurately control the gas flow during the vapor deposition process according to the preset gas flow to ensure the stability of gas concentration and flow in the reaction chamber. Biosflow is the professional manufacturer of EDC-500 series of Massflow Controller.
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