EDC-520 Series Massflow Controller and Meters
- Full Scale Flow Range: 10sccm-1sccm
- Maximum Pressure Rating: 16Mpa
- Repeatability: ±0.2% F.S
- Control Range: 1~100% F.S
- Response Time: <0.8s
- Operating Temperature:0~50℃
- Digital Communication:RS-485(Modbus RTU)
- Analog Communication:0~5 V / 4~20mA
Description of EDC-520 Massflow Controller and Metes
The EDC-500 series Mass Flow Controller (MFC) is specifically designed for the measurement and control of high-pressure gases. Utilizing an advanced capillary-based thermal differential temperature principle, it offers high-pressure resistance, corrosion resistance, high precision, and excellent repeatability. It is compatible with over 180 standard gases and more than 30 types of corrosive gases, making it ideal for applications requiring precise and stable gas flow measurement or control. The electrical interface has undergone rigorous Electromagnetic Compatibility (EMC) testing, ensuring robust performance against static electricity, surges, and electrical fast transient (EFT) interference commonly found in complex industrial environments. The EDC series is CE and RoHS certified, with customizable flow ranges and operating pressures, serving as a premier solution for high-pressure applications.
The MFC supports an inlet pressure of up to 16 MPa, while the outlet can operate under high-pressure, atmospheric, or vacuum conditions. The device’s performance remains unaffected by changes in outlet pressure (or differential pressure), with an allowable operating differential pressure range of 0.3 to 16 MPa. By employing a dynamic differential pressure MFC, users can adjust back-pressure in real-time—accommodating fluctuations in pressure requirements at the process end (or the MFC outlet)—without the need for frequent adjustments to pressure-reducing regulators. This significantly enhances both the ease of use and the reliability of the system. Furthermore, these dynamic differential pressure MFCs are frequently utilized in applications involving the pressurization of sealed vessels.
Biosflows EDC-520 Massflow Controller and Metes Technical Parameters
| Performance | |
|---|---|
| Flow Accuracy | ±0.8 F.S |
| Repeatability | ±0.2% F.S |
| Control Range | 1~100% F.S |
| Response Time | <1s |
| Temperature Coefficient | Zero: <0.05% of F.S./℃. Span: <0.1% of S.P. /℃ |
| Pressure Coefficient | 0.2% of S.P. / Bar |
| Operating Temperature | 0~50℃ |
| Leak Rate | 1x10-9 atm. cc/sec He |
| Preheat Time | 5 min accuracy: ±5% F.S (30 min to achieve the best accuracy) |
| Electrical Parameters | |
| Power Supply | +15~24 V dc |
| Maximum Power Consumption | 10W (MFC); 3W (MFM) |
| Digital Communication | RS-485（Modbus RTU Protocol） |
| Analog Communication | 0~5 V / 4~20mA |
| Electrical Interface | 9-pin D-Connector (male) |
| Mechanical Parameters | |
| Valve Type | Normally closed (MFM meaningless) |
| Substrate Material | 316L stainless steel |
| Sealing Material | FKM, EPDM, NBR |
| Process connections | American / National Standard Ferrule or VCR Fitting |
EDC-520 Massflow Controller and Metes Size and Weight
| Model | A | B | C | D | H | E | F | G | M | Weight |
|---|---|---|---|---|---|---|---|---|---|---|
| EDC-510/1 | 76 | 124 | 13 | 31 | 125 | 56 | 16 | 10 | M4 | 0.95 |
| EDC-515/6 | 76 | 124 | 13 | 36 | 125 | 56 | 16 | 10 | M4 | 0.95 |
| EDC-520/1 | 76 | 124 | 13 | 31 | 125 | 56 | 16 | 10 | M4 | 0.95 |
| EDC-525/6 | 76 | 124 | 13 | 36 | 125 | 56 | 16 | 10 | M4 | 0.95 |
| EDC-53X | 98.5 | 147 | 17 | 45 | 135 | 68 | 22 | 15.2 | M4 | 1.8 |
Features of EDC-520 Massflow Controller and Metes
16 MPa dynamic pressure differential
Supports a dynamic pressure differential of up to 16 MPa, ensuring more stable high-pressure control with adaptive response to pressure differential fluctuations. The sensor and valve body are made of 316L stainless steel, making them suitable for use with toxic and corrosive gases.
High Reliability and Performance
High-performance components are tested seven times consecutively in accordance with semiconductor industry standards to ensure their reliability, which is superior to semiconductor industry standard levels in reliability, ensuring reproducible measurement results and highly stable performance over a long period of use.
New Generation Sensor Design
Innovative sensor design, small influence of temperature and pressure changes, accurate temperature and pressure correction, high linearity can provide excellent signal-to-noise ratio performance to improve measurement and control accuracy under low set-point conditions Long-term zero point stability.
Supports both digital and analog signals
Supports both digital and analog signals, allowing customers to switch between them as desired. Digital measurement and control circuit with enhanced anti-interference capability; compatible with 0–5V or 4–20mA analog signals.
Aplication of EDC-520 Massflow Controller and Metes
Epitaxial Process System
The epitaxial process refers to the process of growing a fully aligned single crystal layer on a substrate. In the manufacture of integrated circuits, the commonly used epitaxy method is vapor phase epitaxy. During the epitaxy process, the gas flow into the reaction chamber needs to be precisely controlled. MFC can be equipped on the gas supply line. By adjusting the control parameters of MFC (such as current or pressure), precise control of gas flow can be achieved to ensure stable and accurate gas flow required in the epitaxy process.
Photovoltaic Industry
A certain amount of gas needs to be supplied during the preparation of solar cells, such as precursor gas and protective gas used to prepare thin films. MFC can be used to control the flow of these gases to ensure the stability and repeatability of the solar cell fabrication process. Flow devices are used in the application layer of crystalline silicon wafers for conventional silicon-based solar cells, as well as in the fabrication of thin layers on flexible substrates as second-generation amorphous silicon-based thin-film solar cell components.
Vapor Deposition System
Vapor deposition is a commonly used thin film preparation technology. The gas precursor is sent into the reaction chamber, and the gas precursor is deposited on the surface of the substrate to form a thin film through a chemical reaction or physical process. MFC can accurately control the gas flow during the vapor deposition process according to the preset gas flow to ensure the stability of gas concentration and flow in the reaction chamber. Biosflow is the professional manufacturer of EDC-500 series of Massflow Controller.
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